| Popis: |
In this study, the feasibility of mini-LED RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on a printed circuit board (PCB). The mini-LEDs under consideration and their sizes are Red ( $125 \times 250 \times 100\mu \mathrm{m}$ ), Green ( $130\times 270\times 100 \mu \mathrm{m}$ ), and Blue ( $130 \times 270\times 100\mu \mathrm{m}$ ). The spacing among the RGB mini-LEDs is $80\mu \mathrm{m}$ , the pixel-to-pixel spacing is also $\sim 80\mu \mathrm{m}$ , and the pixel pitch is $625\mu\mathrm{m}$ . The temporary glass panel for making the RDLs of the package is $515 \times 510\times 1.1\text{mm}$ in size. In order to increase the SMT assembly yield on the PCB, the mini-LEDs are grouped into $4(2\times 2\ \text{pixels})$ in one SMD (surface mount device), i.e., a total of 12 R, B, and G mini-LEDs. A PCB ( $132\text{mm}\times 77\text{mm}$ ) is designed and fabricated for the drop test of the mini-LED package. Thermal cycling of the mini-LED SMD PCB assembly is also performed by a nonlinear temperature- and time-dependent finite-element simulation. |
