REBEL and TDC: Two embedded test structures for on-chip measurements of within-die path delay variations

Autor:	Charles Lamech, James Aarestad, Jim Plusquellic, Reza Rad, Kanak Agarwal
Rok vydání:	2011
Předmět:	Computer science Path delay business.industry business Computer hardware Die (integrated circuit) Test (assessment)
Zdroj:	2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).
DOI:	10.1109/iccad.2011.6105322
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b4f93e2f4202bf68dc8d43f2cc8aea72 https://doi.org/10.1109/iccad.2011.6105322 Zobrazit plný text záznamu