A process for integrated 3D trapping microcoil in microfluidic chips

Autor:	Olivier Lefebvre, Thi-Hong-Nhung Dinh, Marion Woytasik, Mehdi Ammar, Emile Martincic
Rok vydání:	2022
Zdroj:	2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
DOI:	10.1109/dtip56576.2022.9911728
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::b40227041aed3a27819b934e84c54932 https://doi.org/10.1109/dtip56576.2022.9911728 Zobrazit plný text záznamu