Modeling of 3-D Vertical Interconnect Using Support Vector Machine Regression
| Autor: | Ruimin Xu, Lei Xia, Guo Yunchuan, Bo Yan, Jicheng Meng |
|---|---|
| Rok vydání: | 2006 |
| Předmět: |
Engineering
Structured support vector machine business.industry Generalization Regression analysis Condensed Matter Physics Regression Support vector machine Set (abstract data type) Electronic engineering Structural risk minimization Electrical and Electronic Engineering business Algorithm Test data |
| Zdroj: | IEEE Microwave and Wireless Components Letters. 16:639-641 |
| ISSN: | 1531-1309 |
| DOI: | 10.1109/lmwc.2006.885585 |
| Popis: | In this letter, the support vector machine (SVM) regression approach is introduced to model the three-dimensional (3-D) high density microwave packaging structure. The SVM is based on the structural risk minimization principle, which leads to a good generalization ability. With a 3-D vertical interconnect used as an example, the SVM regression model is electromagnetically developed with a set of training data and testing data, which is produced by the electromagnetic simulation. Experimental results suggest that the developed model performs with a good predictive ability in analyzing the electrical performance |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|