Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications

Autor:	Yann Henrion, Sandrine Lhostis, Stephane Moreau, Daniel Scevola, V. Balan, Francois Guyader, Carine Besset, David Bouchu, Anne-Lise Le Berrigo, E. Deloffre, A. Jouve, Julien Pruvost, Sebastien Mermoz
Rok vydání:	2016
Předmět:	010302 applied physics Mass transport Reliability (semiconductor) Materials science 0103 physical sciences Electronic engineering 02 engineering and technology Image sensor 021001 nanoscience & nanotechnology 0210 nano-technology 01 natural sciences Electromigration
Zdroj:	2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc.2016.27
Popis:	This paper presents, for the first time, an electromigration study for a hybrid bonding-based integration for advanced image sensor applications. This work demonstrates that the hybrid bonding module has no impact on the electromigration resistance of the present integration. The weakest link is always the BEoL level. There is no hybrid bonding-related failure.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::aa087c1878e6f6f7fe0a5107ac309479 https://doi.org/10.1109/ectc.2016.27 Zobrazit plný text záznamu