Aerosol Jet Etching for Silicon Solar Cells
| Autor: | Lennon, A.J., Renn, M., King, B., Wenham, S. |
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| Jazyk: | angličtina |
| Rok vydání: | 2009 |
| Předmět: | |
| DOI: | 10.4229/24theupvsec2009-2dv.1.77 |
| Popis: | 24th European Photovoltaic Solar Energy Conference, 21-25 September 2009, Hamburg, Germany; 2246-2249 The key to high-efficiency silicon solar cells is the ability to form small-area metal contacts to the silicon through dielectric passivating layers. In this paper we describe a new method for patterned etching of SiO2 and SiNx dielectric layers. The method uses Optomec’s Aerosol Jet Printer to deposit a solution containing fluoride ions, according to an etching pattern, onto an acidic water-soluble polymer layer formed over the dielectric layer. The deposited solution reacts with the polymer layer, at the locations where it is deposited, to form an etchant that etches the SiO2 and SiNx under the polymer layer to form a pattern of openings in the dielectric layer. The acidic watersoluble polymer and the etch residue are then easily removed by rinsing in water. The method involves fewer steps than photolithography and is safer than existing immersion etching techniques as the corrosive etchant is only formed in-situ on the surface to be etched. Furthermore, the method uses small amounts of inexpensive chemicals and produces significantly less hazardous fluoride waste than existing immersion etching methods. |
| Databáze: | OpenAIRE |
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