Stress Relaxation in Epoxy Thermosets via a Ferrocene-Based Amine Curing Agent
| Autor: | Hayden T. Black, Mathias C. Celina, Brad H. Jones, Nicholas Henry Giron, Todd M. Alam, Timothy N. Lambert, Mark E. Stavig, Patricia Sue. Sawyer, David R. Wheeler |
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| Rok vydání: | 2017 |
| Předmět: |
Materials science
Polymers and Plastics Thermosetting polymer 02 engineering and technology 010402 general chemistry 01 natural sciences Inorganic Chemistry chemistry.chemical_compound Residual stress Diamine Polymer chemistry Materials Chemistry Stress relaxation Composite material Curing (chemistry) chemistry.chemical_classification Organic Chemistry Epoxy Polymer 021001 nanoscience & nanotechnology 0104 chemical sciences Ferrocene chemistry visual_art visual_art.visual_art_medium 0210 nano-technology |
| Zdroj: | Macromolecules. 50:5014-5024 |
| ISSN: | 1520-5835 0024-9297 |
| DOI: | 10.1021/acs.macromol.7b00501 |
| Popis: | Physical stress relaxation in rubbery, thermoset polymers is limited by cross-links, which impede segmental motion and restrict relaxation to network defects, such as chain ends. In parallel, the cure shrinkage associated with thermoset polymerizations leads to the development of internal residual stress that cannot be effectively relaxed. Recent strategies have reduced or eliminated such cure stress in thermoset polymers largely by exploiting chemical relaxation processes, wherein temporary cross-links or otherwise transient bonds are incorporated into the polymer network. Here, we explore an alternative approach, wherein physical relaxation is enhanced by the incorporation of organometallic sandwich moieties into the backbone of the polymer network. A standard epoxy resin is cured with a diamine derivative of ferrocene and compared to conventional diamine curing agents. The ferrocene-based thermoset is clearly distinguished from the conventional materials by reduced cure stress with increasing cure temp... |
| Databáze: | OpenAIRE |
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