A Fully 3D-Printed Conformal Patch Antenna using Fused Filament Fabrication Method
| Autor: | Jacob Lewis, Shengrong Ye, Benjamin D. Braaten, Kazi Sadman Kabir, Dipankar Mitra, Sayan Roy, Jerika Cleveland, Ryan Striker |
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| Rok vydání: | 2020 |
| Předmět: |
Patch antenna
Materials science Fabrication business.industry 020206 networking & telecommunications Fused filament fabrication 02 engineering and technology Microstrip antenna Printed circuit board 0202 electrical engineering electronic engineering information engineering Optoelectronics Antenna (radio) business Electrical conductor Ground plane |
| Zdroj: | 2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting. |
| DOI: | 10.1109/ieeeconf35879.2020.9329909 |
| Popis: | Additive manufacturing technology has recently created a very useful engineering option for prototyping a wide range of electronic devices owing to its intrinsic aspects of fast turn-around, accuracy, easier fabrication, and low implementation costs. Electrifi, a commercially available conductive filament has been lately reported by multiple researchers as a potential candidate for replacing traditional copper traces on printed circuit boards through additive manufacturing technologies. For the first time, this paper presents a completely 3D-printed conformal microstrip patch antenna. Using the fused filament fabrication method, the flexible conductive layers and the flexible non-conductive substrate of the antenna were additively manufactured using materials: Electrifi and NinjaFlex, respectively. Furthermore, for validation of the manufactured flexible prototype, a similar model was fabricated and tested where one of the trace layers made of Electrifi filament was replaced using a commercial adhesive copper foil. Overall, the reported fully 3D-printed flexible antenna shows similar performance to the partially 3D-printed patch antenna with a single side copper foil as the reference ground plane. |
| Databáze: | OpenAIRE |
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