The microstructure of CVD diamond for high-density thermal inkjet
| Autor: | Seog Soon Baek, Bumkyoo Choi, Yong-Soo Oh |
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| Rok vydání: | 2005 |
| Předmět: |
Engineering drawing
Materials science Passivation Bubble Nozzle Diamond Chemical vapor deposition engineering.material Condensed Matter Physics Electronic Optical and Magnetic Materials Hardware and Architecture Heat transfer engineering Liquid bubble Electrical and Electronic Engineering Composite material Layer (electronics) |
| Zdroj: | Microsystem Technologies. 11:386-395 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s00542-004-0471-7 |
| Popis: | The microstructure for high-density thermal inkjet (TIJ) is proposed to overcome the defect due to the limit of the nozzle density in conventional TIJs. To bring high-density TIJ, the heat transfer of diamonds by means of placing heaters on sidewall of ink inlet is used in order to minimize the area occupied by the heaters. In addition, manifold, inlet, pressure chamber and nozzle concerning the flow of ink are placed in-line. To demonstrate feasibility, TIJ for bubble visualization test is designed and fabricated. Diamond is deposited on the sidewall of inlet with Hot Filament CVD (HFCVD). The trench filling method and the side deposition method are executed for the vertical sidewall of diamond. To solve the problem for direct CVD deposition on Pt layer, Ta film is utilized as a passivation layer in the fabrication processing. The generated bubble confirms the possibility of the bubble formation by heat transfer of diamond. |
| Databáze: | OpenAIRE |
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