High-Power LED Chip-on-Board Packages With Diamond-Like Carbon Heat-Spreading Layers
| Autor: | Tsai Pai-Yang, Kan Ming-Chi, Chien-Min Sung, Hou-Kuei Huang, Yeong-Her Wang |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Diamond-like carbon business.industry 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Electronic Optical and Magnetic Materials law.invention Light intensity Printed circuit board Thermal conductivity law 0103 physical sciences Optoelectronics Junction temperature Electrical and Electronic Engineering 0210 nano-technology business Flip chip Diode Light-emitting diode |
| Zdroj: | Journal of Display Technology. 12:357-361 |
| ISSN: | 1558-9323 1551-319X |
| Popis: | The thermal properties of a flip-chip light-emitting diode (FCLED) chip-on-board (COB) with diamond-like carbon (DLC) heat-spreading layers are investigated. The temperature-dependent performance of the COB packages with and without DLC heat-spreading layers at the LED and metal core printed circuit board sites are studied. Results show that the device junction temperature and thermal conductivity of the COB package with DLC heat-spreading layers (DLC package) are less than those of the COB package without DLC heat-spreading layers (regular package). For the steady state of light intensity, the mean of light intensity drop for 12 tested packages of DLC package was improved by 6.1% after 3 hours of burn-in compared with that of the regular package. |
| Databáze: | OpenAIRE |
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