Smart in-line defectivity/metrology process control solution for advanced 3D integration
| Autor: | Darcy Hart, Amina Sidhoum, Arnaud Garnier, Sandra Bos, Justin Miller, Nicolas Devanciard, Gilles Vera, Franck Bana, Carlos Beitia, N. Bresson, Dario Alliata, John Thornell, Scott Balak, Stephane Rey |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Interconnection Engineering business.industry Process (computing) 02 engineering and technology 021001 nanoscience & nanotechnology Inspection time 01 natural sciences Die (integrated circuit) Metrology Visual inspection 0103 physical sciences Automotive Engineering Electronic engineering Process control 0210 nano-technology business Throughput (business) |
| Zdroj: | International Symposium on Microelectronics. 2016:000032-000037 |
| ISSN: | 2380-4505 |
| Popis: | When combined with in-line local metrology, Automatic Visual Inspection/Classification is a powerful tool to characterize 3D interconnect processes, either at the R&D level or in volume manufacturing environments. A new methodology that uses visual inspection results to drive local smart metrology was used for the first time to control the fabrication process of micro-pillar/micro-bump vertical contacts. Quantification of the inspection time when the smart logic concept was used revealed a throughput increase of 23% on average, while consistency of the automatic morphological accuracy was preserved as confirmed by in-line mechanical profilometry. The morphology characterization is discussed with respect to the electrical performances at die level. |
| Databáze: | OpenAIRE |
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