| Autor: |
Martin A. Brooke, Elias N. Glytsis, A. Chellapa, T. Nonaka, Jaemin Shin, J. Hall, Thomas K. Gaylord, T. Suzuki, Nan Marie Jokerst, D.L. Geddis, M. Vrazel, Sang-Yeon Cho, Ricardo A. Villalaz |
| Rok vydání: |
2004 |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Advanced Packaging. 27:376-385 |
| ISSN: |
1521-3323 |
| DOI: |
10.1109/tadvp.2004.831894 |
| Popis: |
This paper explores design options for planar optical interconnections integrated onto boards, discusses fabrication options for both beam turning and embedded interconnections to optoelectronic devices, describes integration processes for creating embedded planar optical interconnections, and discusses measurement results for a number of integration schemes that have been demonstrated by the authors. In the area of optical interconnections with beams coupled to and from the board, the topics covered include integrated metal-coated polymer mirrors and volume holographic gratings for optical beam turning perpendicular to the board. Optical interconnections that utilize active thin film (approximately 1-5 /spl mu/m thick) optoelectronic components embedded in the board are also discussed, using both Si and high temperature FR-4 substrates. Both direct and evanescent coupling of optical signals into and out of the waveguide are discussed using embedded optical lasers and photodetectors. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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