Cu-based alloys for 3DP by melt extrusion process
| Autor: | Ren C. Luo, Bernard Haochih Liu, An-Bang Wang, C. S. Chou, W. C. J. Wei |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
Annealing (metallurgy) business.industry Metallurgy Alloy chemistry.chemical_element 02 engineering and technology Zinc Raw material engineering.material Conductivity 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Grain size 0104 chemical sciences chemistry Thermal insulation Electrical resistivity and conductivity engineering 0210 nano-technology business |
| Zdroj: | ICIT |
| DOI: | 10.1109/icit.2016.7474918 |
| Popis: | A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100oC-extrusion capability, high heating rate (930 oC/ 5 min), good thermal insulation, compact and light weight. Various Cu-based alloys, i.e. Cu-Zn alloys, were selected and prepared as the feedstock filaments for the ME 3DP. Oxidation kinetics of 8020 Cu-Zn alloy, pure Cu, and other metallic alloys were investigated and compared to that in N2 atmosphere. Besides, the electric conductivity is reported and discussed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|