| Autor: |
Mukhzeer Mohamad Shahimin, K. Thangsi, V. Retnasamy, S. Kirtsaeng, N. R. Ong, S. Sakuntasathien, Z. Sauli, J. B. Alcain, Rajendaran Vairavan, S. L. Lai |
| Rok vydání: |
2017 |
| Předmět: |
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| Zdroj: |
AIP Conference Proceedings. |
| ISSN: |
0094-243X |
| Popis: |
Metal core printed circuit board (MCPCB) is the vital component that provides electrical and thermal support to ensure the Light-emitting diodes (LEDs) performs well. Most of the MCPCB shapes are designed according to the LED application fixture and housing. Thus the shape of MCPCB does not attract the attention for heat dissipation improvement. This study has exploited the open source software, Salome and Elmer for modelling and thermal simulation. Various shapes of MCPCB were investigated in this study and effect of the shape was outlined in the discussion session. The result shows that the isoperimetric inequality in the geometry of the MCPCB does influence the heat dissipation performance. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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