Low profile Flip-Type or Embedded Silicon Capacitors for decoupling
| Autor: | Franck Murray, Catherine Bunel |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
business.industry Electrical engineering Power integrity Hardware_PERFORMANCEANDRELIABILITY Filter capacitor law.invention Capacitor Film capacitor Hardware_GENERAL law Hardware_INTEGRATEDCIRCUITS Electronic engineering Pharmacology (medical) Signal integrity Ceramic capacitor business Decoupling (electronics) Group delay and phase delay |
| Zdroj: | Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:001967-001991 |
| ISSN: | 2380-4491 |
| Popis: | The very high capacitance platform of the 3D Silicon capacitors technology presents lots of interest in different domains. In this paper we'll focus on Optical networking, Signal and Power integrity .The intrinsic IPDiA Silicon capacitors group delay, a key parameter in the phase sensitive broadband applications, will be compared with the multilayer ceramic capacitor (MLCC) one. All the components involved in the main signal line have indeed to manage properly their phase behavior to minimize their group delay impact on final performances. First ,the intrinsic construction and the simplified equivalent electrical models will be compared .Secondly, it will be demonstrated how the Silicon Capacitors are better candidates for performances ,miniaturization and integration thanks to their low profile whereas the high thickness is a limiting factor for Ceramic capacitors. On top of the competitive overview of performances specific to the Ultra Wide Broadband Capacitors, signal integrity, frequency response, linearity, dielectric absorption, the silicon capacitor technology benefits will be detailed .Design recommendations will be given to those who want to optimize performances in the overall broadband optical system. The perspectives and roadmap for the future will be disclosed. |
| Databáze: | OpenAIRE |
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