| Autor: |
Heinz-Dietrich Bruns, Miroslav Kotzev, Thomas-Michael Winkel, Christian Schuster, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller |
| Rok vydání: |
2010 |
| Předmět: |
|
| Zdroj: |
3rd Electronics System Integration Technology Conference ESTC. |
| DOI: |
10.1109/estc.2010.5642944 |
| Popis: |
In this paper the authors present results from the crosstalk analysis of a high density single ended connector and its associated card via array obtained with 12-port vector network analyzer (VNA) measurements in the bandwidth from 10 MHz up to 20 GHz. The device under test used for this paper is typical for a high end mainframe processor node to node link scenario consisting of daughter cards plugged into a backplane card by using a multipin connector. In previous studies the authors have shown that mainly the connector via pin field is impacting the electrical link performance. Here, the measurements have shown that the via pin field constitutes a complex crosstalk problem depending on the orientation and the distance between victim and aggressor via, the common coupled via lengths, and the local power/ground environment. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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