Autor: |
Ramesh Rao Nistala, Zishan Ali, Xiaoxuan Li, Xintong Zhu, Lawrence Selvaraj, Lulu Peng, Zhi Qiang Mo, Chor Shu Cheng |
Rok vydání: |
2019 |
Předmět: |
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Zdroj: |
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA). |
DOI: |
10.1109/ipfa47161.2019.8984815 |
Popis: |
In this study, soft magnetic thin films including Co-Zr-Ta (CZT) and its variant are deposited on TEOS SiO2 and polyimide to characterize the interfacial adhesion strength of the full magnetic stack using the 4-Point-Bending (4PB) technique. Variation in critical load value Gc, an indicator of the interfacial adhesion strength, is observed. Auger Electron Spectroscopy (AES) is performed for elemental analysis to confirm the interface of de-lamination. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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