Open-ended microwave oven for flip-chip assembly

Autor:	George Goussetis, K.I. Sinclair, Marc P.Y. Desmulliez, Alan J. Sangster
Rok vydání:	2008
Předmět:	Surface-mount technology Permittivity Materials science business.industry Electrical engineering Relative permittivity law.invention Resonator law Optoelectronics Electrical and Electronic Engineering business Wafer-level packaging Waveguide Flip chip Microwave
Zdroj:	IET Microwaves, Antennas & Propagation. 2:53-58
ISSN:	1751-8733 1751-8725
DOI:	10.1049/iet-map:20060316
Popis:	A novel open-ended waveguide cavity resonator for the microwave curing of bumps, underfills and encapsulants is described. The open oven has the potential to provide fast alignment of devices during flip-chip assembly, direct chip attach, surface mount assembly or wafer-scale level packaging. The prototype microwave oven was designed to operate at X-band for ease of testing, although a higher frequency version is planned. The device described in the paper takes the form of a waveguide cavity resonator. It is approximately square in cross-section and is filled with a low-loss dielectric with a relative permittivity of 6. It is excited by end-fed probes in order to couple power preferentially into the TM 3,3,k mode with the object of forming nine 'hot-spots' in the open end. Low power tests using heat sensitive film demonstrate clearly that selective heating in multiple locations in the open end of the oven is achievable.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::9b46242ed0bcfc18b97ea90301b1da34 https://doi.org/10.1049/iet-map:20060316 Zobrazit plný text záznamu