| Autor: |
H. Kudo, Y. Oguri, Yoichiro Matsumoto, Takayuki Ohba, Hideki Kitada, Ikuya Kinefuchi, A. Tsukune, Young Suk Kim, K. Fjimoto |
| Rok vydání: |
2013 |
| Předmět: |
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| Zdroj: |
2013 IEEE International Electron Devices Meeting. |
| Popis: |
A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C3S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the Pmax of 1 × 104 Pa and Qmax of 38 μl/min. Cooling capability as high as 140 W/cm2 was demonstrated for the first time. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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