A new bulk-micromachining using deep RIE and wet etching for an accelerometer

Autor:	Masayoshi Esashi, Seog-Soon Baek, Geunbae Lim
Rok vydání:	1998
Předmět:	Bulk micromachining Materials science business.industry Mechanical Engineering Structural engineering Accelerometer Anodic bonding Optoelectronics Dry etching Electrical and Electronic Engineering Diffusion (business) Reactive-ion etching Anisotropy business Beam (structure)
Zdroj:	IEEJ Transactions on Sensors and Micromachines. 118:420-424
ISSN:	1347-5525 1341-8939
DOI:	10.1541/ieejsmas.118.420
Popis:	A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P ++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::953cefa726640bb9f83c5667f9d35da2 https://doi.org/10.1541/ieejsmas.118.420 Zobrazit plný text záznamu