Whole-Chip Delayering for Failure Analysis and Quality Assurance
| Autor: | David Douglass, Kyle Godin |
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| Rok vydání: | 2023 |
| Předmět: | |
| Zdroj: | EDFA Technical Articles. 25:4-8 |
| ISSN: | 1537-0755 |
| DOI: | 10.31399/asm.edfa.2023-2.p004 |
| Popis: | Broad ion beam delayering is a versatile technique for whole-chip failure analysis. The large area of uniformity coupled with the ability to precisely stop at the layer of interest facilitates repeatable, rapid defect detection anywhere on the chip. |
| Databáze: | OpenAIRE |
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