Defect gallery and bump defect reduction in the self Aligned Double Patterning module

Autor:	Cathy Cai, Deenesh Padhi, Martin Seamons, Chris Bencher, Chris Ngai, BH Kim
Rok vydání:	2010
Zdroj:	2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::90ea3c682d1bc08679e929d8a9037a70 https://doi.org/10.1109/asmc.2010.5551437 Zobrazit plný text záznamu