Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
| Autor: | Robert L. Sankman, Yidnekachew S. Mekonnen, Kemal Aygun, Sujit Sharan, Islam A. Salama, Ravi Mahajan, Neha M. Patel, Deepti Iyengar, Dae-Woo Kim, Debendra Mallik, Zhi-Guo Qian |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Interconnection Materials science business.industry Bandwidth (signal processing) Three-dimensional integrated circuit High density 02 engineering and technology 01 natural sciences 020202 computer hardware & architecture Chip-scale package 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Reticle Electronic engineering High bandwidth business Computer hardware |
| Zdroj: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc.2016.201 |
| Popis: | The EMIB dense MCP technology is a new packaging paradigm that provides localized high density interconnects between two or more die on an organic package substrate, opening up new opportunities for heterogeneous on-package integration. This paper provides an overview of EMIB architecture and package capabilities. First, EMIB is compared with other approaches for high density interconnects. Some of the inherent advantages of the technology, such as the ability to cost effectively implement high density interconnects without requiring TSVs, and the ability to support the integration of many large die in an area much greater than the typical reticle size limit are highlighted. Next, the overall EMIB architecture envelope is discussed along with its constituent building blocks, the package construction with the embedded bridge, die to package interconnect features. Next, the EMIB assembly process is described at a high level. Finally, high bandwidth signaling between the die is discussed and the link bandwidth envelope is quantified. |
| Databáze: | OpenAIRE |
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