New aspects of micromachining and microlithography using 157-nm excimer laser radiation

Autor:	J. Fair, M. Rahe, M. Kauf, D. Basting, M. Fiebig, H. Endert
Rok vydání:	1999
Předmět:	Materials science Fabrication Excimer laser business.industry medicine.medical_treatment Nanotechnology General Chemistry Integrated circuit Radiation Photon energy Laser law.invention Surface micromachining law medicine Optoelectronics General Materials Science business Lithography
Zdroj:	Applied Physics A: Materials Science & Processing. 69:S305-S307
ISSN:	1432-0630 0947-8396
Popis:	The use of F2 excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F2 excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8ac3c0eb4ffe862f5082b3cae2f6e856 https://doi.org/10.1007/s003390051405 Zobrazit plný text záznamu Plný text ve formátu PDF