System in Package Feasibility Process

Autor:	P.P. Stoppino, A. Conci, T. Lessio, D. Ferrara
Rok vydání:	2009
Předmět:	Flexibility (engineering) Software development process Computer engineering Computer science Package on package Process (computing) Package development process Design process Process design System on a chip Electrical and Electronic Engineering Reliability engineering
Zdroj:	Proceedings of the IEEE. 97:141-147
ISSN:	0018-9219
DOI:	10.1109/jproc.2008.2007475
Popis:	This paper describes the procedure and the software process to verify the feasibility of a system in package. The process has been created to guarantee and ensure the main characteristics of such devices: a minimum time-to-market and great flexibility. A procedure is described for every step, starting from application definition to final electrical analysis. After a general introduction, all process design steps are technically analyzed; then each step of the final process check is described. Some comments and wishes are discussed in the conclusion.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8a45d26c60d1fcb0553d334aadd823b6 https://doi.org/10.1109/jproc.2008.2007475 Zobrazit plný text záznamu