| Popis: |
The use of Low Temperature Co-Fired Ceramics (LTCC) is a very attractive material option for advanced packaging. For applications, a variety of features are printed in the base material: thermal and electrical vias, resistors, solder pads to name a few. Most of these features have materials that are thermally and elastically mismatched from the LTCC, producing a localized residual stress. These stresses impact the strength and reliability of the LTCC package. Here we present results and analysis for the strength and reliability assessment of an LTCC (Dupont™ 951) with and without Au vias. The reliability of the ceramic material is assessed from the perspective of its susceptibility to sub-critical crack growth (SCG). Metallic vias can significantly lower the strength of the LTCC, however, their presence does not change the measured susceptibility of the material to SCG. Using our experimental data, and empirical descriptions of SCG laws, safe design life for LTCC packages under a particular stress state is estimated. |
