Processing of ultra-hard materials with picosecond pulses: From research work to industrial applications
| Autor: | Gediminas Račiukaitis, Valdemar Stankevič, Adam Čermák, Saulius Mikalauskas, Pavel Kožmín, Simonas Indrišiūnas |
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| Rok vydání: | 2018 |
| Předmět: |
0209 industrial biotechnology
Materials science Biomedical Engineering 02 engineering and technology Fluence law.invention chemistry.chemical_compound 020901 industrial engineering & automation Tungsten carbide law Surface roughness Ceramic Instrumentation business.industry Pulse duration Cermet 021001 nanoscience & nanotechnology Laser Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials chemistry visual_art Numerical control visual_art.visual_art_medium Optoelectronics 0210 nano-technology business |
| Zdroj: | Journal of Laser Applications. 30:032202 |
| ISSN: | 1938-1387 1042-346X |
| DOI: | 10.2351/1.5040633 |
| Popis: | The ultrashort laser processing of the cutting tools and cutting inserts from tungsten carbide, ceramic and metal composites (CERMET), and polycrystalline diamond materials was demonstrated, and the ablation rates of mentioned ultra-hard materials were evaluated for a laser wavelength of 1064 and 532 nm. The optimal processing throughput was estimated. Laser manufacturing was performed with the five-axis computer numerical control (CNC) machine and scanner for beam translation with the high speed and the ultrashort ∼12 ps pulse duration high repetition rate laser source. The systematic approach was implemented in an experimental variation of process parameters that play a significant role in processing quality. By varying the laser fluence, pulse overlap, and layers’ count, different material removing rates can be achieved from 300 nm/layer to ∼18 μm/layer. The submicrometer removing rate involves a high precision control of the structure depth. It was demonstrated that only by a minor change of the processing parameters, the surface roughness of the material could be minimized down to Ra |
| Databáze: | OpenAIRE |
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