| Popis: |
Polymers have been extensively used as encapsulating materials in electronic packaging, but low thermal conductivity creates an obstacle for effective heat dissipation. To mitigate this, one fundamental route is to develop high-thermal-conductivity (high-κ) polymers. Recently in Science Advances, Li and colleagues9 proposed a polymer film created by solution-gel-shearing ultrahigh-molecular-weight polyethylene, possessing both high thermal conductivity and electrical insulation properties simultaneously. |
