Determining adhesion of critical interfaces in microelectronics – a reverse Finite Element Modelling approach based on nanoindentation – Part I
| Autor: | Reinhard Pufall, Georg M. Reuther, Sven Rzepka, J. Albrecht, Rainer Dudek |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
Silicon business.industry chemistry.chemical_element 02 engineering and technology Nanoindentation 021001 nanoscience & nanotechnology 01 natural sciences Engineering physics Finite element method chemistry visual_art 0103 physical sciences visual_art.visual_art_medium Microelectronics Ceramic Adhesive Thin film 010306 general physics 0210 nano-technology business Shrinkage |
| Zdroj: | 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). |
| DOI: | 10.1109/eurosime48426.2020.9152755 |
| Popis: | In modern microelectronic devices, mechanical robustness and reliability have become more and more challenging, which is mainly due to continuous shrinkage of dimensions. At the same time a wide variety of thin film materials – metals, ceramics and glasses - are stacked and micro-structured for optimized device performance. Perfect adhesion of these thin film layers, even after exposure to thermal treatment or in presence of intrinsic stress, is crucial for device reliability. In particular, interfaces between isolating and metallization layers require careful assessment due to different bonding types of the materials involved. |
| Databáze: | OpenAIRE |
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