A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding

Autor:	Jiwon Shin, Kwangbok Woo, Donguk Kwon, Youngja Kim, Youngmin Lee, Dongwoo Kang, Krutikesh Sahoo, Haoxiang Ren, Yu-Pei Huang, Ujash Shah, Yutao Yang, Ankit Kuchhangi, Subramanian S. Iyer
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00187
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::84689c5cf9afcd42a18ca6802319af09 https://doi.org/10.1109/ectc51906.2022.00187 Zobrazit plný text záznamu