Mechanical behavior of ceramic-metal joint under quasi-static and dynamic four point bending: Microstructures, damage and mechanisms
| Autor: | Weiguo Guo, Li Li, Dong-xiao Fu, Xia Yu |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Universal testing machine Digital image correlation Materials science Process Chemistry and Technology 02 engineering and technology Slip (materials science) Split-Hopkinson pressure bar 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Surfaces Coatings and Films Electronic Optical and Magnetic Materials Flexural strength visual_art Soldering 0103 physical sciences Materials Chemistry Ceramics and Composites visual_art.visual_art_medium Ceramic Composite material 0210 nano-technology |
| Zdroj: | Ceramics International. 43:6684-6692 |
| ISSN: | 0272-8842 |
| DOI: | 10.1016/j.ceramint.2017.02.064 |
| Popis: | This paper studies the mechanical behavior of Alumina ceramic-Kovar joint under quasi-static and dynamic four-point bending (FPB). The joint is fabricated by molybdenum-manganese (Mo-Mn) metallization method with extra additions. The bend strength of the joint is improved by glass phase migration. Electronic universal testing machine and modified split Hopkinson pressure bar (SHPB) are employed to realize the loading process. The microstructure of the joint is investigated by scanning electron microscope (SEM) and the chemical composition is determined by energy dispersive spectrometer (EDS). Digital image correlation (DIC) technique is used to determine the displacement contours and ultra-high speed camera is used to monitor the deformation and crack evolution around the joint. It is found that the specimen will slip due to the different Young's modulus of base material. The dynamic bend strength of the joint is lower than the quasi-static bend strength. The failure mechanism of the ceramic-metal joint is mainly intergranular failure for the dynamic bend but mixed transgranular/intergranular failure for the quasi-static case. The crack starts from the inherent voids inside the ceramic and then expands along the metallization band between solder and ceramic. |
| Databáze: | OpenAIRE |
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