Hexagonal Boron Nitride: Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer (Adv. Electron. Mater. 6/2021)

Autor:	Yunjo Jeong, Michael Cai Wang, Takashi Taniguchi, Ossie Douglas, Rubayat-E Tanjil, Kenji Watanabe, Utkarsh Misra
Rok vydání:	2021
Předmět:	Materials science Passivation business.industry Hexagonal boron nitride Electron Electromigration Electronic Optical and Magnetic Materials Metal visual_art visual_art.visual_art_medium Optoelectronics Angstrom business Layer (electronics)
Zdroj:	Advanced Electronic Materials. 7:2170020
ISSN:	2199-160X
DOI:	10.1002/aelm.202170020
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::7b7bedfe9d7a387ae2dbc5280a5b48aa https://doi.org/10.1002/aelm.202170020 Zobrazit plný text záznamu Plný text