Four-point bend adhesion measurements of copper and permalloy systems

Autor:	Steven P. Bozeman, Srinivas L.N. Chakravarty, Laura C. Stearns, Brian L. Kelly, Robert F. Cook, David P. Harkens, Dylan J. Morris, Michael P. Hughey
Rok vydání:	2004
Předmět:	Permalloy Silicon oxynitride Materials science Mechanical Engineering Metallurgy Delamination chemistry.chemical_element Adhesion Copper Crack closure chemistry.chemical_compound chemistry Mechanics of Materials General Materials Science Thin film Composite material Stress corrosion cracking
Zdroj:	Engineering Fracture Mechanics. 71:245-261
ISSN:	0013-7944
DOI:	10.1016/s0013-7944(03)00100-0
Popis:	The four-point bend split-beam method is used to quantitatively determine the interfacial fracture resistance and crack velocity as a function of mechanical energy release rate of the weakest interface in a thin film stack. Various interfaces of importance to magnetic storage devices are studied, including copper or nickel–iron (permalloy) on silicon oxynitride with additional adhesion promoters. The dynamics and kinetics of the four-point bend test are fully elucidated. A model for environmentally-controlled crack growth previously applied to bulk ceramics is used here as a model for interfacial crack growth and is found to fit the kinetic data.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::79b074e177ce1588e9be769aeb7c5b02 https://doi.org/10.1016/s0013-7944(03)00100-0 Zobrazit plný text záznamu Full Text from ScienceDirect