High Thermal Assembly Solution for Large FOEB Chiplets Integrated Package in HPC Application
| Autor: | Hsin-Jou Lin, Xi-Zhang Hsu, Long-Yuan Wang, Yuan Hung Hsu, Y.P Wang |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). |
| DOI: | 10.1109/icept56209.2022.9872620 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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