| Autor: |
Ivan Shubin, Jon Lexau, John E. Cunningham, Xuezhe Zheng, David Rolston, Ashok V. Krishnamoorthy, Ron Ho |
| Rok vydání: |
2009 |
| Předmět: |
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| Zdroj: |
2009 59th Electronic Components and Technology Conference. |
| DOI: |
10.1109/ectc.2009.5074015 |
| Popis: |
We present a novel optically-enabled ball grid array (OBGA) package that integrates conventional electrical I/O, proximity communication (PxC), and optical communication in one industry-compatible BGA package for the first time. The key enabling technologies for such a packaging solution, including the precision alignment needed to combine multiple CMOS chips and compact opto-electronic (OE) subassemblies, are detailed here. We designed and fabricated a 45 mm × 45 mm × 5.2 mm organic cavity-down BGA package with up to 600 solder balls for electrical I/O. Its cavity holds three CMOS chips, with PxC interfaces and optical driver/receiver circuits, as well as two multi-channel optical subassemblies with standard optical fiber connections. We report preliminary testing results. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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