Study on properties of Sn–9Zn–Ga solder bearing Nd
| Autor: | Songbai Xue, Peng Xue, Lili Gao, Yi-fu Shen, Hong Zhu |
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| Rok vydání: | 2011 |
| Předmět: |
Bearing (mechanical)
Materials science Metallurgy Rare earth Moderate amount Condensed Matter Physics Microstructure Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention law Soldering Phase (matter) Wetting Electrical and Electronic Engineering Composite material Quad Flat Package |
| Zdroj: | Journal of Materials Science: Materials in Electronics. 23:1272-1278 |
| ISSN: | 1573-482X 0957-4522 |
| Popis: | The effects of Nd on wettability, microstructure and mechanical properties of Sn–9Zn–Ga–xNd lead-free solder were investigated. The results indicate that adding moderate amount of rare earth Nd, the wettability as well as mechanical properties of Sn–9Zn–0.5Ga solder were evidently improved, and when the content of Nd is at 0.08 wt%, the best wettability and comprehensive properties of soldered joint were obtained. It was also found that the addition of rare earth Nd could refine the microstructure of the solder, but some dark NdSn3 phase appeared when the addition of Nd exceeded 0.15 wt%. Moreover, the IMCs thickness at the solder/Cu interface was reduced with the addition of Nd which gave a favorable influence on the mechanical property of the soldered joints. |
| Databáze: | OpenAIRE |
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