Statistical analysis on the mechanical and micro-structural characteristics of thermosonic Cu Al interconnection

Autor: T. Joseph Sahaya Anand, Yong Foo Khong, Chua Kok Yau, R.T. Rajendra Kumar, Lim Boon Huat, S. Shariza, Ranjit Singh Sarban Singh, Lee Cher Chia
Rok vydání: 2020
Předmět:
Zdroj: Microelectronics Reliability. 109:113664
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2020.113664
Popis: In this study, Cu wire-Al bond pad (Cu Al) samples were produced by means of Thermosonic wire bonding technique. Both IMC and ball shear strength were assessed for samples produced with different bonding temperatures, HTS duration and forming gas supply. The experiments were carried out using Taguchi and conventional “one parameter at a time” approaches. For Taguchi method, experiment was managed with L9 orthogonal array for optimizing the wire bonding process. It was observed that the process was optimized with forming gas supply ON, bonding temperature of 400 °C and after 1000 h of HTS treatment. This was achieved by a continuous and uniform growth of the IMC across the bonding interface. As for experiment based on “one parameter at a time” approach, a linear proportionality between IMC thickness and ball shear strength was observed. This indicated no void formation at the bonding interface of the sample. In addition, with increased number of run in this experiment, the regression analysis involving interaction of factors was allowed. The measurements' data was found to fit better in the additive model including the interaction of factors. Besides, an additional model based on the fundamental IMC growth behaviour with regards to the bonding temperature and HTS duration was proposed. Regression analysis of this model showed an agreement with measurement data.
Databáze: OpenAIRE
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