Tool condition monitoring by quality during the micro milling process by using IoT and AI

Autor:	V. naveen Kumar, Gurpreet Singh, S. Rudresha, S Sampath Kumar
Rok vydání:	2022
Zdroj:	2022 6th International Conference on Electronics, Communication and Aerospace Technology.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::710b91f95da633f9af634ea8e0400552 https://doi.org/10.1109/iceca55336.2022.10009545 Zobrazit plný text záznamu