Materials Characterization of Plasma Deposited Copolymers using CFC-113, CFC-12 and PFC-116 with C2H4 Monomers
| Autor: | Osamu Tsuji, Hirohiko Nakano, Kikuko Yoshimura, Takeshi Minaguchi, Toshiaki Tatsuta |
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| Rok vydání: | 1998 |
| Předmět: | |
| Zdroj: | Journal of Photopolymer Science and Technology. 11:307-312 |
| ISSN: | 1349-6336 0914-9244 |
| DOI: | 10.2494/photopolymer.11.307 |
| Popis: | CFC-113 (Cl2FC/CClF2), CFC-12 (CCl2F2), and PFC-116 (F3C/CF3) were each combined with ethylene (H2C=CH2) in plasma copolymerization to deposit polymer films. The relative deposition rate was shown to be CFC-113>CFC-12>PFC-116, which indicates that the presence of Cl may serve to accelerate the polymerization rate. With a C2H4 mixing ratio of 1:1, the C-H(stretching vibration) peak of the IR spectrum from the resulting film disappeared for CFC-113/CCl4, which contains Cl. In comparison, the C-H peak for PFC-116, which does not contain Cl, is still apparent, indicating that an H abstraction reaction took place. The results of thermal stability showed that a weight loss starts at 200°C for polymers deposited by CFC-113 and CFC-12, and at 250°C for polymers deposited by PFC-116. The melting point exceeded 300°C for all polymers, and was in excess of 400°C for PFC-116. Dielectric constant of polymers deposited by PFC-116/C2H4, which contains H, was stable at 2.9 regardless of the source gas mixing ratio. Polymers deposited with CFC-113 and CFC-12 demonstrated a decrease in dielectric constant (1.9∼2.1) as the CFCs concentration was increased. These results indicate that polymer films deposited in a plasma copolymerization using monomer gases including CFCs may potentially be used in various applications, such as materials for micro electronic devices. |
| Databáze: | OpenAIRE |
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