| Autor: |
Patrick J. French, Pasqualina M. Sarro, Alvise Bagolini, J.M.W. Laros, C.R. de Boer, H.T.M. Pham, L. Pakula |
| Rok vydání: |
2004 |
| Předmět: |
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| Zdroj: |
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664). |
| DOI: |
10.1109/sensor.2003.1215598 |
| Popis: |
In this paper we present a novel post-process surface micromachining module that uses a commercial PI2610 polyimide as a sacrificial layer and PECVD SiC or SiN as structural layers. No wet etching is required thus avoiding stiction problems often encountered in wet sacrificial etching processes. A mask set containing cantilever beams, membranes, rotating structures, microswitches, etc. is applied to evaluate the potential of this process module. Silicon carbide micro-mechanical switches with different beam size are also designed and prepared using the three-mask process module suitable for appending to a CMOS fabrication sequence. A displacement /spl ges/15 /spl mu/m is achieved for 95 V and 235 V for the 1 /spl mu/m and 2 /spl mu/m wide silicon carbide beam, respectively. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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