Analyzing the Impact of Die Positions inside the Power Module on the Reliability of Solder Layers for Different Power Cycling Scenarios

Autor:	Bhanu Pratap Singh, Shirong Li, Khaled Redwan Choudhury, Staffan Norrga, Hans-Peter Nee
Rok vydání:	2023
Zdroj:	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
DOI:	10.1109/eurosime56861.2023.10100764
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::68350624047d979d644901d0e63f08b6 https://doi.org/10.1109/eurosime56861.2023.10100764 Zobrazit plný text záznamu