Highly reliable joining for high‐temperature power modules: Ni–Sn DSLID with an Al sheet
| Autor: | Hirofumi Ito, Makoto Kuwahara, Hiroaki Kadoura, Masanori Usui |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
020209 energy 020208 electrical & electronic engineering chemistry.chemical_element Fracture mechanics 02 engineering and technology Temperature cycling Thermal expansion Stress (mechanics) chemistry Creep Aluminium Power module Soldering 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Composite material |
| Zdroj: | IET Power Electronics. 12:492-497 |
| ISSN: | 1755-4543 |
| DOI: | 10.1049/iet-pel.2018.5590 |
| Popis: | Highly reliable operation at high temperatures is required for next-generation power modules in electric vehicles. We propose a joining concept involving nickel–tin (Ni–Sn) double solid–liquid interdiffusion with an aluminium (Al) sheet (Ni–Sn DSLID/Al), which enables the production of modules with high thermal reliability. The use of Ni–Sn DSLID/Al joint as bonding layers for a large thermal coefficient mismatch [silicon (Si) chip: 3.9 × 10−6 K−1, copper electrode plate: 16.5 × 10−6 K−1] effectively decreased the compressive stress to 250 MPa in the Si chip, compared with that of a conventional Ni–Sn SLID joint (500 MPa) after joining. Moreover, the stress was relaxed when heating to 200°C during thermal cycling (from −40 to 200°C), due to the plastic and creep deformations of the inserted Al sheet. In addition, Ni–Sn DSLID/Al joint suppressed crack propagation during thermal cycling and exhibited higher thermal durability than Ni–Sn SLID and Sn–10% antimony solder joints up to 500 cycles, due to the higher resistances of the plastic and creep deformations of the inserted Al sheet. The present concept demonstrates great potential for use in fabricating joints for next-generation power modules. |
| Databáze: | OpenAIRE |
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