| Autor: |
Jerry Aw Jie Li, Ho Siow Ling, Daniel Rhee Min Woo, Lee Jong Bum, Zhang Songbai, Hwang How Yuan |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). |
| DOI: |
10.1109/eptc.2014.7028383 |
| Popis: |
The SiC based high power 3 phase inverter module with double side cooling structure was developed. By applying flipchip bonding of SiC based high power DMOSFET device on DBC substrate, the source and gate bonding could be achieved. The drain interconnection was done by copper clip attach. The developed structure can provide the flat structure for both top and bottom surfaces, which can be effectively utilized for double side cooling design for high power heat dissipation. In addition to power module design with double side cooling capability, the high temperature endurable material set which can endure over 220°C device junction temperature such as high temperature interconnection, encapsulation and TIM (thermal interface materials) are developed and identified. Through the thermal, mechanical, electrical modeling & characterization and the reliability test for the developed functional test vehicles, the author could demonstrate the possibility of flip-chip based double side cooling capable high power module structure which can be utilized to high power and high temperature endurable applications for future wide band-gap device such as SiC and GaN based inverter modules. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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