Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

Autor:	Pin-Chieh Huang, Hsin-Ying Tung, Shih-Ping Lee, Chung-Tien Chou, Tzu-Hsuan Tseng, Chih-Hao Chuang, Chien-Ying Chuang, Cheng-Hung Cheng
Rok vydání:	2019
Předmět:	Materials science Chemical-mechanical planarization Scientific method Shallow trench isolation Metallurgy
Zdroj:	2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM).
DOI:	10.23919/emdc/issm48219.2019.9052083
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5b49ec814cebb1f318b42e6666b0ef7a https://doi.org/10.23919/emdc/issm48219.2019.9052083 Zobrazit plný text záznamu