Beyond Interfacial Anion/Cation Pairing: The Role of Cu(I) Coordination Chemistry for the Action of Leveler Additives in Copper Electroplating

Autor:	Minh Thi Nguyen Hai, Felice Janser, Tobias Brunner, Alexander Fluegel, Fabio Simona, Michele Cascella, Karl Kraemer, Dieter Mayer, Marco Arnold, Peter Broekmann
Rok vydání:	2012
Zdroj:	ECS Meeting Abstracts. :3285-3285
ISSN:	2151-2043
DOI:	10.1149/ma2012-02/45/3285
Popis:	not Available.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::54c18e52c50a77d5f93865f44b054892 https://doi.org/10.1149/ma2012-02/45/3285 Zobrazit plný text záznamu