| Autor: |
U. Drofenik, Johann W. Kolar, R. Schmidt, Ivana F. Kovacevic |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
2008 11th Workshop on Control and Modeling for Power Electronics. |
| DOI: |
10.1109/compel.2008.4634691 |
| Popis: |
For lifetime estimation of power converters in traction applications, one method is to calculate numerically the stress-strain hysteresis curves of the interfaces silicon-solder-DCB and/or DCB-solder-baseplate inside the power modules. This can only be achieved if the transient junction temperatures in these layers are known for a defined mission-profile. Therefore, one has to couple circuit simulation with thermal simulation and stress-strain computation. The second challenge of this problem is to perform this transient simulation taking into account switching losses in the mus-range for mission profiles over a couple of minutes. In this paper we employ a new multi-domain simulation software to achieve results with reasonable computational effort. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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