Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating
| Autor: | Chien Chih Chen, T K Chang, J H Yang, S B Jang, P C Yeh, Jing Chie Lin, D L Lee |
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| Rok vydání: | 2005 |
| Předmět: |
Copper substrate
Materials science Fabrication Mechanical Engineering chemistry.chemical_element Nanotechnology Electronic Optical and Magnetic Materials Micrometre Nickel chemistry Mechanics of Materials Motion Mode Electrical and Electronic Engineering Composite material Electroplating Platinum Microfabrication |
| Zdroj: | Journal of Micromechanics and Microengineering. 15:2405-2413 |
| ISSN: | 1361-6439 0960-1317 |
| DOI: | 10.1088/0960-1317/15/12/024 |
| Popis: | Micrometer nickel columns were fabricated by a novel process called microanode guided electroplating (MAGE). In the MAGE process, a microanode of platinum (125 µm in diameter) was controlled to move in either continuous or intermittent mode to guide the progress of Ni-electroplating. The microfabrication was guided from the location of a copper substrate that is initially in contact with the microanode to develop a micrometer column and its appearance was determined by the motion mode (i.e., continuous or intermittent) of the microanode. The intermittent MAGE was superior to the continuous one for fabricating micrometer nickel columns with fine surface morphology and uniform diameter. Different models are proposed and they are simulated by the commercial software ANSYS 8.0 to understand the quantitative distribution in the process of MAGE. |
| Databáze: | OpenAIRE |
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