Control of compound forming reaction at the interface between SnZn solder and Cu substrate

Autor:	Hisao Irie, Tetsu Ichitsubo, Takaaki Anada, Seishi Kumamoto, Kozo Fujiwara, Masahiko Yamaguchi, Eiichiro Matsubara
Rok vydání:	2005
Předmět:	Materials science Scanning electron microscope Mechanical Engineering Metallurgy Metals and Alloys Intermetallic Liquidus Microstructure Differential scanning calorimetry Mechanics of Materials Soldering Materials Chemistry Melting point Thermal analysis
Zdroj:	Journal of Alloys and Compounds. 392:200-205
ISSN:	0925-8388
DOI:	10.1016/j.jallcom.2004.09.043
Popis:	Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn–Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98−xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210–220 °C by alloying Cu or Ni of 2.6–2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::50ec035465857e6d7195fac297ce748f https://doi.org/10.1016/j.jallcom.2004.09.043 Zobrazit plný text záznamu Full Text from ScienceDirect