| Autor: |
Jae-Youn Park, Sang-Bo Han, Hoon Choi |
| Rok vydání: |
2014 |
| Předmět: |
|
| Zdroj: |
Journal of the Korean Institute of Illuminating and Electrical Installation Engineers. 28:1-12 |
| ISSN: |
1229-4691 |
| DOI: |
10.5207/jieie.2014.28.7.001 |
| Popis: |
This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area`s LED. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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