Working environment choice technological aspects during clean-up vibration-abrasive processing of device parts with small grooves and holes
| Autor: | Boris G. Soldatov, Yelena Kolganova, Mikhail A. Tamarkin |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Computer science media_common.quotation_subject Abrasive Mechanical engineering 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Vibration 0103 physical sciences Quality (business) 0210 nano-technology Reduction (mathematics) Working environment media_common |
| Zdroj: | Materials Today: Proceedings. 38:1385-1387 |
| ISSN: | 2214-7853 |
| DOI: | 10.1016/j.matpr.2020.08.109 |
| Popis: | The article describes the device parts vibration processing features in granular environment. The processing environment particle-size characteristics selection with the purpose of achieving specified surface quality requirements basic schemes and methodological principles are presented. These processing technological principles are currently determined on the basis of preliminary experimental studies resulting in significant cost and time increasing. The main tasks arising when processing parts with small grooves and holes are divided into three groups. Dependencies and recommendations have been given resulting in significant finishing and cleaning operations time reduction and productivity increasing without laborious preliminary experimental studies. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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